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I'm trying to simulate a simple chip-heatsink situation in SolidWorks using their thermal modeling suite. I have found an ideal set of parametric values for the chip to work at a reasonable temperature, but I need to figure out what the convection coefficient means in terms of air flow rates across the chip. Honestly, if someone could give me a simple breakdown in how to do this calculation, I would be very grateful!

The bulk temperature on the chip side is set to 1500 K with a convection of 20 W/m^2-K. I went with 20 rather than 30 (which I was told was a good approximation for standing air) because a colleague thought that the convective coefficient would vary based on the power flux going into the chip (30,000 W/m^2) by about 10% divided by the temperature yielding 20 W/m^2-K. I'm not sure if this procedure is correct, so any input on that would be helpful as well.

So I guess, succinctly, my two questions are 1) what is the convective coefficient for still and moving air at 1500 K and 2) how can I derive airflow from the heat transfer coefficient?