How to calculate maximum surface pressure a silicon wafer can withstand?

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SUMMARY

The discussion focuses on calculating the maximum surface pressure a silicon wafer can withstand in a project involving the conversion of gasified biomass to liquid ethanol using a palladium catalyst in a silicon microporous matrix. Key equations and concepts include the bending of plates, stress intensity factors, and fracture toughness, which are crucial due to the wafer's porous structure with 3.5nm pores. The load on the wafer is determined by the pressure difference across it, which is influenced by the flow rate. Participants recommend consulting a professor and conducting destructive testing to validate theoretical results.

PREREQUISITES
  • Understanding of bending of plates
  • Knowledge of stress intensity factors
  • Familiarity with fracture toughness concepts
  • Basic principles of poroelasticity
NEXT STEPS
  • Research the bending of plates in material science
  • Study stress intensity factors and their applications
  • Learn about fracture toughness and its measurement techniques
  • Investigate Terzaghi Effective Stress in porous materials
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Engineers, material scientists, and researchers involved in the design and testing of porous materials, particularly in applications related to catalysis and fluid dynamics.

Katana750
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Long story short, I'm working on a senior design project this semester, (involves converting a gassified biomass to a liquid ethanol using a palladium catalyst embedded in a silicon microporous matrix). I'm currently struggling what should be a fairly basic equation, but it's been too long since I've looked at such equations. Given known dimensions of the silicon wafer, (including the fact that we're removing 75% of the volume of the silicon due to the pores). The pores are small enough (3.5nm) that I assume we can generally assume the pressure relief offered by the pores is negligible.

Anyway, the question is, what equation gives us the maximum pressure the top surface of the volume can support without collapsing? (We will need to develop a pressure above the matrix to generate a reasonable flow rate through the pores).

Thanks in advance!
 
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Katana750 said:
Long story short, I'm working on a senior design project this semester, (involves converting a gassified biomass to a liquid ethanol using a palladium catalyst embedded in a silicon microporous matrix). I'm currently struggling what should be a fairly basic equation,

It is not a basic equation..
See here:
http://en.wikipedia.org/wiki/Bending_of_plates

Add that to the fact your material is full of holes which act as many cracks so stress intensity factors are important:

http://en.wikipedia.org/wiki/Stress_intensity_factor

http://en.wikipedia.org/wiki/Fracture_toughness
Katana750 said:
The pores are small enough (3.5nm) that I assume we can generally assume the pressure relief offered by the pores is negligible.
The load will depend entirely on the pressure difference from one side to the other and that depends on the flow rate.

I'd suggest talking to the relevant professor at your university. Also, do some destructive testing to get some idea of the variability of your material and whether real results align with theoretical results
http://en.wikipedia.org/wiki/Destructive_testing
 
You need to study up a little on the subject of Poroelasticity, which handles stress analysis in porous materials with internal pressurization. Look up Terzaghi Effective Stress.

Chet
 

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