Life expectancy of Aqueous Flux going LowZ

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Discussion Overview

The discussion centers on the life expectancy of water-soluble flux in relation to low impedance (low Z) conditions, specifically focusing on how long it takes for conductive materials to migrate and potentially create low impedance bridges under various humidity and temperature conditions.

Discussion Character

  • Exploratory
  • Technical explanation
  • Debate/contested

Main Points Raised

  • Some participants inquire about the specific life expectancy data for water-soluble flux and its conductive materials under low Z conditions.
  • There is a mention of dendritic migration of copper, with one participant suggesting that it can occur within a few hundred hours given a voltage difference and depending on temperature and cleanliness of the PC board.
  • Another participant emphasizes the need to consider the expected failure rate of components with water-soluble flux residue left under large BGAs, noting that complete removal of flux may not be feasible.
  • Participants suggest that there may be relevant industry studies available online regarding BGA reliability and PCB cleaning that could provide additional insights.

Areas of Agreement / Disagreement

Participants express a shared interest in understanding the life expectancy of water-soluble flux and its implications, but there is no consensus on specific data or outcomes, and multiple viewpoints regarding the factors influencing conductive material migration are presented.

Contextual Notes

The discussion highlights uncertainties regarding the specific conditions under which conductive migration occurs, including the influence of humidity, temperature, and the cleanliness of the PCB. There are also unresolved questions about the interaction between flux residues and exposed copper.

edwardtre
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Looking for any life expectancy data for water soluble flux going low Z. How long it takes for conductive material to migrate and cause low impedance bridges at any humidity or temperature.
 
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edwardtre said:
Looking for any life expectancy data for water soluble flux going low Z. How long it takes for conductive material to migrate and cause low impedance bridges at any humidity or temperature.

Welcome to the PF.

Are you asking specifically just about the flux aspect, or about dendritic migration of copper in general?

I did a Google search on dendritic migration pc board, and got some good hits:

https://www.google.com/search?sourc..._l=hp...0i22i30l5.0.0.1.13565...0.YrpWiZego6U

Once you have a voltage difference between conductors of a couple of volts or so, you can get dendritic migration to happen in a few hundred hours, depending on temperature and PC board cleanliness...
 
Thanks for the response. Specifically the conductive material that is part of the flux. Need to consider expected failure rate of a component with water soluble flux (OA) residue left under a BGA (BGA too large to allow for complete removal of flux (45mm part). Though I guess it could be a combination of the flux and exposed copper...
 
edwardtre said:
Thanks for the response. Specifically the conductive material that is part of the flux. Need to consider expected failure rate of a component with water soluble flux (OA) residue left under a BGA (BGA too large to allow for complete removal of flux (45mm part). Though I guess it could be a combination of the flux and exposed copper...

It seems like there should be some good PCBA industry studies on this. I Googled bga reliability pcb cleaning, and got some good hits. Maybe have a look at the hit list to see if you see any new information:

https://www.google.com/search?sourc...cleaning&gs_l=hp...0.0.0.9110...0.epKIo8N_xH8

:smile:
 

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