Maximizing MOSFET Switching Speed with High Voltage Pulse Techniques

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Discussion Overview

The discussion focuses on the factors influencing the switching speed of MOSFETs, particularly in relation to high voltage pulse techniques. Participants explore the relationship between gate voltage application, rise and fall times, and the physical limitations imposed by the MOSFET's characteristics.

Discussion Character

  • Technical explanation
  • Debate/contested

Main Points Raised

  • One participant questions whether the source/drain rise and fall times depend solely on the gate voltage rise and fall times, suggesting that applying a high voltage for a short duration could expedite the charging and discharging of the gate.
  • Another participant explains that the gate's distributed resistance and capacitance create an RC transmission line effect, introducing a time delay in turning on the gate regardless of the applied voltage.
  • A participant notes that while MOSFETs can turn on very quickly, there is a finite time required for the channel to form after exceeding the threshold voltage due to the need for carriers to flow from the source or drain.
  • One participant mentions that excessive energy can lead to damage in MOSFETs, drawing a parallel to CMOS circuits failing when overclocked.
  • A later reply simplifies the process to electron flow from the gate, suggesting a resistive flow model for understanding the dynamics involved.

Areas of Agreement / Disagreement

Participants express differing views on the implications of applying high voltages and the inherent limitations of MOSFET switching speeds. There is no consensus on the optimal approach or the extent to which high voltage techniques can be effectively utilized without risking damage.

Contextual Notes

Participants acknowledge the complexities of the MOSFET's behavior, including the effects of resistance and capacitance, but do not resolve the implications of these factors on switching speed or reliability under high voltage conditions.

Who May Find This Useful

Individuals interested in semiconductor physics, circuit design, and high-speed electronics may find this discussion relevant.

ctech4285
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ok looking at datasheets for mostfet there is source/drain rise and fall time. does this only depend on the voltage rise fall time of the gate?
so if you apply a voltage to the gate it will take a wile until the voltage of the actual gate reaches that of the applied voltage because of resistance and capacitance of the gate. so you could apply a very high voltage for a short a time to charge discharge the gate as fast as you possible want. maybe a few 100V timed to exactly the time needed for the gate to reach let's say 10V, maybe nano/pico seconds. now of course there will be a point at which you burn enough energy to blow up the mosfet
 
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Since the gate has distributed resistance and capacitance, it acts like an RC transmission line. This means there is a time delay to turn on the gate, no matter how much voltage you apply. Also, it takes a finite time for the channel to form once the threshold voltage is exceeded, since the carriers to form the channel need to flow out from the source or drain. Mosfets can turn on very quickly (in ps), but the turn on time can never be zero.
 
now of course there will be a point at which you burn enough energy to blow up the mosfet
That's the reason CMOS circiuts blow up when you overclock them.
 
so the entire process is just a electrons flowing from the gate. and so you can model this as restive flow from he gate...thank for clarifying this!
 

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