Problems in Copper and Zinc Electroplating

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Discussion Overview

The discussion revolves around the process of copper and zinc electroplating, focusing on the setup, conditions, and spontaneity of the plating reactions. Participants explore the specifics of the plating process, including the materials used and the effects of applying current.

Discussion Character

  • Technical explanation
  • Debate/contested

Main Points Raised

  • Some participants note that copper plating on an iron nail is spontaneous and question the necessity of applying current.
  • Others suggest that using current can enhance the plating process, allowing for thicker layers to be deposited.
  • There is a query about the spontaneity of zinc electroplating on iron, given zinc's more negative standard electrode potential.
  • Participants discuss the configuration of electrodes, specifically the use of iron nails and the identification of the anode and cathode in the setup.
  • One participant points out a potential issue with the original post's formatting, indicating a need for clarification on the electrode materials used.

Areas of Agreement / Disagreement

Participants express differing views on the necessity of current for copper plating and the spontaneity of zinc electroplating. The discussion remains unresolved regarding the specifics of the plating setup and the roles of the electrodes.

Contextual Notes

There are limitations regarding the precise measurement of solution concentration and the identification of electrode materials, which may affect the discussion's conclusions.

hojess02
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TL;DR
Hi~
Pic 1: The first time we electroplated iron nail with copper. The surface of the nail had black substance after electroplating it.
Pic 2: The second time we did it & we used a lower concentration of copper(II) sulphate as electrolyte.

I wonder is that black substance copper oxide & what is the relationship between that black substance and the concentration of copper(II) sulphate.

Thanks!!
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Welcome to PF. :smile:

Can you say more about your plating setup? What settings are you using? How long are you letting the plating process run?
 
Cu plating on an iron nail is spontaneous. You shouldn’t have needed any current. What was the other electrode made of? Were those galvanized nails?
 
chemisttree said:
Cu plating on an iron nail is spontaneous.
With current the process can be definitely speed up (and you can plate much thicker layers).
 
berkeman said:
Welcome to PF. :smile:

Can you say more about your plating setup? What settings are you using? How long are you letting the plating process run?

We used 3.0V (combination of two 1.5V batteries), copper plate, iron nail, 2 wires with crocodile clips, copper(II) sulphate solution (about 0.5M) (We didn't measure the concentration precisely) ThxThx
 
Last edited by a moderator:
chemisttree said:
Cu plating on an iron nail is spontaneous. You shouldn’t have needed any current. What was the other electrode made of? Were those galvanized nails?
I see... Is zinc electroplating on iron spontaneous too? Since zinc has a more negative standard electrode potential. Those were non-galvanized nails.
 
Borek said:
With current the process can be definitely speed up (and you can plate much thicker layers).
I see... thanks!
 
You are using two iron nails for electrodes. Only one will produce copper. Which one is black? Anode or cathode?
 
  • #10
chemisttree said:
You are using two iron nails for electrodes. Only one will produce copper. Which one is black? Anode or cathode?
There is a problem with OP post formatting, but I believe they used copper plate for the anode.
 

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