Question re. electroplated gold. Thank you

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Electroplating gold on a silicon wafer with a gold seed layer resulted in a black and granular finish. The user set the effective current to 1.9 mA for a 19mm² area, aiming for a thickness of 50 micrometers. Suggestions include reducing the current, as 100 A/m² may be excessive for the process. Additionally, the choice of electrolyte is crucial; it should slightly dissolve gold to help eliminate defects during layer growth. Proper adjustments to these parameters may improve the electroplating results.
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Hello, I have a question for electrodeposition of gold.

So I tried to electroplate gold on a Si wafer with gold seed layer on it. I used SU-8 as my photoresist to form a pattern. But my electroplated gold was black and granular.

Area is 19mm^2 and desired thickness is 50 um. I set the effective current to be 1.9 mA.

Any ideas?

Thank you so much!
 
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1. Try to reduce current, 100A/m^2 may be too much for electroplating.
2. What kind of electrolite do you use? Normally, it should slightly dissolve gold to remove defects of growing layer.
 
It may be shown from the equations of electromagnetism, by James Clerk Maxwell in the 1860’s, that the speed of light in the vacuum of free space is related to electric permittivity (ϵ) and magnetic permeability (μ) by the equation: c=1/√( μ ϵ ) . This value is a constant for the vacuum of free space and is independent of the motion of the observer. It was this fact, in part, that led Albert Einstein to Special Relativity.
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