Questions on Rs measurement by four point probe device

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The discussion focuses on measuring the sheet resistance (Rs) of CuO thin films using an Agilent B1500 device, highlighting issues encountered during the measurement process. The samples undergo a two-step annealing process, leading to inconsistent Rs values that vary widely across different current points, raising concerns about the accuracy of the measurements. The potential for CuO's mechanical weakness and the interaction between probe materials and the copper oxide is noted as a factor that could affect results. Additionally, comparisons are made to existing literature, which reports Rs values significantly higher than those observed in the current measurements. The need for precise measurement techniques and the challenges posed by the material properties are emphasized as critical for the research.
Hanyuri
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Hi all,
I am working on electronics material (using metal oxide as an active layer in TFTs). Currently, I'm trying to measure the sheet resistance (Rs) of CuO thin film (~100nm in thickness). My lab uses Agilent B1500 device for measuring the Rs. I met some problems when carrying out the measurement:

For my case, CuO nanoparticle solution is deposited and is annealed by 2 step annealing ( in inert gas first and then is oxidized in very low % O2). At the first step, the samples has very low and specific Rs, which showed as a metallic material (Cu), but after the second step, the Rs is not clearly. The Rs drop at every different current points are varied widely and not specific from a few ohms/sq. (I~1-100mA) to Gohms/sq. (I~1-100nA). If they are insulating, there should be no voltage drops between the probes. I wonder why it happened like that and whether there is any wrong in my measurement.

I alse referred some other scientific articles. They reported that CuO thin film has Rs ~ tens of kohm/sq (the deposition method is RF sputtering).

This measurement is very important for my research. I hope that some of you have done this measurement before.
I will greatly appreciate if somebody can help me for this case. Please feel free to contact me if you nees any further information.
 
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CuO is mechanically very weak . It is very easy to punch right through it or at least reduce local thickness with probes .

Pointed probes are particularly problematic . Small diameter spherical end probes give a variable contact area and indentation depending on applied load .

Copper oxide can react with some probe metals to produce a small voltage .
 
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