The black electronic component in question is an integrated circuit (IC), commonly referred to as "chip on board" (COB). This manufacturing technique involves directly assembling the IC die onto a printed circuit board (PCB) without traditional packaging, making it suitable for mass production of low-cost devices. COB components are designed to be resistant to vibration and moisture, but if they fail, the entire PCB must be replaced. The discussion also highlights that once the die is wire bonded to the PCB, it is encased in a black plastic blob for protection. The symbol for this component was not explicitly provided in the discussion.