CMos digital integrated circuits by Kang-Leblebici

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The discussion centers on understanding the behavior of the MOS layer in CMOS digital integrated circuits as described in Kang-Leblebici's book. Key points include the analogy of the MOS layer to a capacitor, the differences in work functions and Fermi levels between the metal, oxide, and semiconductor layers, and the resulting bending of the Fermi levels at their junctions. The potential drop occurs due to these work function differences, with the majority of the drop seen at the oxide/semiconductor interface. Clarification is sought on why the Fermi level bends and the reasoning behind the maximum potential drop across the oxide/semiconductor junction. The bending is explained as a necessity for continuity at the contact point, and the electrostatic induction effect is suggested as a more effective way to understand the underlying principles of MOSFET operation.
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Im using CMos digital integrated circuits by Kang-Leblebici. On p85-86 a description of how a MOS layer works is given which I can't fully understand.

First, the MOS layer is likened to a capacitor. Then they discuss how the work functions and fermi levels of the metal, oxide layer and the semi conductor layer differ. When these layers are put together a bending in the fermi levels of the semi condutor takes place. Also, because of the difference in work functions, a potential drop occurs between the metal and semi conductor layer with the majority of the drop at the semi conductor and oxide junction.

I don't understand the part about the work functions causing a potential drop and the fermi layer bending. Why does the layer bend at all? Why doesn't the fermi layer of the metal layer also bend? Also, why is there maximum potential drop across the oxide/semiconductor junction?

Could someone please walk me through this? If any of the questions are not clear enough, please tell me and ill try to be clearer.
 
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It's not the best way to intuit how MOSFETs work. Good if you want to derive model equations.

Specific to the question: bending occurs because of continuity requirements - contacting two materials together with different work functions requires that they be equal at that point of contact. Thus they must bend.

Better is to consider the electrostatic induction effect of the gate through the oxide and into the semiconductor in terms of Gauss's law. This is how the basic models are derived ab initio for MOSFETs.
 
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