Comparison of thermal shock profiles

AI Thread Summary
The discussion centers on comparing two thermal shock test profiles that differ in temperature change rates and dwell times at high and low temperatures. The user seeks guidance on understanding the severity of each profile to select a suitable component for qualification limits. A reference to the STRIFE profile is made, highlighting a standard ramp rate of 10°C/minute, which is considered effective for identifying design and manufacturing issues. Concerns are raised about faster ramp rates potentially causing false failures, while slower rates may not adequately reveal reliability problems. The conversation emphasizes the importance of clearly labeling test profiles for accurate analysis.
mrajkumar
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Could someone help me in comparing 2 different thermal shock test profiles effect on a component. The 2 profiles are varied in deg C /min change and also the dwell time in low and high tempwratures. Any references are highly appreciated. Thank you
 
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mrajkumar said:
Could someone help me in comparing 2 different thermal shock test profiles effect on a component. The 2 profiles are varied in deg C /min change and also the dwell time in low and high tempwratures. Any references are highly appreciated. Thank you
Looks like the profiles did not Upload. Can you try again? Use the UPLOAD button in the lower right of the Edit window to upload PDF or JPEG images... :smile:
 
Also, is this for schoolwork?
 
I am trying to compare the thermal shock profiles to understand the severity of each and ways to compare them. This is required to choose a component for my required qualification limit. I've uploaded the profile herewith. Requesting a guidance.
Thermal shock2.jpg
 

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I'm assuming the Temperature is in degrees C and the Time is in minutes? (It's best to always label your axes with units to avoid ambiguity) :smile:

The standard temperature stress profile that I'm familiar with (learned first at Hewlett Packard many years ago) is the STRIFE profile, which uses 10C/minute temperature ramps (hence liquid CO2 cooling is required for the ramps down), along with power cycling during the ramps and after soaking at the extremes of the profile. Using ramps faster than about 10C per minute can cause false failures, depending on how complex your electronics are, and going more slowly than 10C/minute doesn't really help you find all of the design and manufacturing issues that you would like to find in this kind of reliability testing.

The profile that we typically use on medium-size Industrial temperature range products is shown below. The vertical cross-hatched bars show where the power to the UUTs is turned off. We typically also add in some off times during some of the temperature ramps. Are the ramp rates for the faster profile you show in your figure close to 10C/minute?

LTS-20 STRIFE Profile.JPG
 

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