Comparison of thermal shock profiles

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SUMMARY

This discussion focuses on comparing two thermal shock test profiles, specifically examining the effects of varying degrees Celsius per minute (°C/min) changes and dwell times at low and high temperatures on components. The STRIFE profile, known for its 10°C/minute temperature ramps, is highlighted as a standard method, emphasizing the importance of avoiding ramp rates faster than this to prevent false failures. Participants discuss the necessity of labeling axes with units for clarity and share insights on power cycling during thermal shock tests to enhance reliability assessments.

PREREQUISITES
  • Understanding of thermal shock testing methodologies
  • Familiarity with the STRIFE thermal shock profile
  • Knowledge of temperature ramp rates and their impact on component reliability
  • Experience with data visualization, specifically labeling axes in test profiles
NEXT STEPS
  • Research the STRIFE thermal shock profile and its application in reliability testing
  • Explore the effects of different temperature ramp rates on electronic components
  • Learn about power cycling techniques during thermal shock tests
  • Investigate best practices for documenting and presenting thermal shock test results
USEFUL FOR

Engineers, reliability testing professionals, and quality assurance specialists involved in component selection and thermal shock testing methodologies will benefit from this discussion.

mrajkumar
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Could someone help me in comparing 2 different thermal shock test profiles effect on a component. The 2 profiles are varied in deg C /min change and also the dwell time in low and high tempwratures. Any references are highly appreciated. Thank you
 
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mrajkumar said:
Could someone help me in comparing 2 different thermal shock test profiles effect on a component. The 2 profiles are varied in deg C /min change and also the dwell time in low and high tempwratures. Any references are highly appreciated. Thank you
Looks like the profiles did not Upload. Can you try again? Use the UPLOAD button in the lower right of the Edit window to upload PDF or JPEG images... :smile:
 
Also, is this for schoolwork?
 
I am trying to compare the thermal shock profiles to understand the severity of each and ways to compare them. This is required to choose a component for my required qualification limit. I've uploaded the profile herewith. Requesting a guidance.
Thermal shock2.jpg
 

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I'm assuming the Temperature is in degrees C and the Time is in minutes? (It's best to always label your axes with units to avoid ambiguity) :smile:

The standard temperature stress profile that I'm familiar with (learned first at Hewlett Packard many years ago) is the STRIFE profile, which uses 10C/minute temperature ramps (hence liquid CO2 cooling is required for the ramps down), along with power cycling during the ramps and after soaking at the extremes of the profile. Using ramps faster than about 10C per minute can cause false failures, depending on how complex your electronics are, and going more slowly than 10C/minute doesn't really help you find all of the design and manufacturing issues that you would like to find in this kind of reliability testing.

The profile that we typically use on medium-size Industrial temperature range products is shown below. The vertical cross-hatched bars show where the power to the UUTs is turned off. We typically also add in some off times during some of the temperature ramps. Are the ramp rates for the faster profile you show in your figure close to 10C/minute?

LTS-20 STRIFE Profile.JPG
 

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