Is a CFD Model Accurate in Predicting Temperature of a Computer Chip in a Duct?

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The CFD model indicates that the maximum temperature for the laminar case is 440 K, while the turbulent case is 395 K, which raises questions about the expected temperature behavior. The average temperature for both cases is approximately 310 K. Enhanced mixing in the turbulent boundary layer contributes to a higher heat transfer coefficient, which may explain the lower maximum temperature in the turbulent case. This outcome contrasts with the assumption that turbulent flow would yield higher temperatures. The findings suggest that the model's predictions align with fluid dynamics principles, emphasizing the role of flow characteristics in heat transfer.
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I am running a CFD model with a computer chip measuring .06 x .05 x .005 m immersed in a rectangular duct measuring .3 x .1 x .02 m. The flow has velocity of about 2.5 m/s. The maximum temp. for the laminar case is about 440 K, while the max temp. for the turbulent case is 395 K. Does this sound right? I would have guessed the turbulent case would have a higher temp.
Both cases have about the same average temperature (~310 K).
 
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turbulent boundary layer has enhanced mixing, & hence enhanced heat transfer coefficient.

Take a look at the plot
 

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