The discussion centers on the life expectancy of water-soluble flux in low-Z applications, particularly regarding conductive material migration and its impact on low impedance bridges under varying humidity and temperature conditions. Participants highlight the significance of dendritic migration, noting that it can occur within a few hundred hours when a voltage difference exists between conductors. The conversation emphasizes the need for specific data on the failure rates of components with residual flux, especially under large BGAs where complete flux removal is challenging. Suggestions for further research include looking into industry studies and resources related to BGA reliability and PCB cleaning. The thread ultimately seeks to gather more empirical data on the longevity and reliability of aqueous flux in these contexts.
