Principleof wave and reflow solderng

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Wave and reflow soldering methods rely on the melting and reflowing of solder to create electrical connections between component leads and printed circuit boards (PCBs). Key principles include capillary forces and surface minimization, which facilitate the wetting of the metal by solder. The heated flux plays a crucial role in enhancing wetting properties. Understanding these principles is essential for optimizing soldering processes. Overall, the discussion emphasizes the need for clarity on the underlying scientific principles rather than just procedural knowledge.
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guys I've beng searching internet long time to find the principle used behind wave and reflow soldering methods,but all i get is about its procedure.

can anyone tell me what is the principles behind these two methods
thanks
 
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The metal solder melts / reflows and forms an electrical connection between the components' leads and the PCB?

If you really, really, want a principle, maybe capillary forces and/or surface minimization involved in the wetting of the metal by the solder (or maybe, the heated flux allowing for wetting). I'm not a materials chemist.
 
I'm not sure,question was "what is the principle used in following soldering methods?"
 
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