Why is sulphuric acid added to copper sulfate solution for electroplating?

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Electroplating with a 5 micron layer of copper involves the use of sulphuric acid in the solution for two primary reasons. Chemically, sulphuric acid helps maintain a lower pH, which is essential for the stability of the solution, particularly for heavy metals. Additionally, from an electrical standpoint, the presence of sulphuric acid can enhance the conductivity of the solution, improving the efficiency of the electroplating process. Understanding these roles is crucial for optimizing electroplating outcomes.
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Electroplated a 5 micron layer of copper a few days ago. Was wondering why there's sulphuric acid in the solution.
 
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There are two reasons I can think of - one is strictly chemical (almost every heavy metal needs lowered pH for a solution to be stable) the other is an electrical one.
 
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