Electroplating with a 5 micron layer of copper involves the use of sulphuric acid in the solution for two primary reasons. Chemically, sulphuric acid helps maintain a lower pH, which is essential for the stability of the solution, particularly for heavy metals. Additionally, from an electrical standpoint, the presence of sulphuric acid can enhance the conductivity of the solution, improving the efficiency of the electroplating process. Understanding these roles is crucial for optimizing electroplating outcomes.