Backgating (chip) advantages.

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Backgating and electrochemical gating are two methods for controlling conducting polymers on chips, each with distinct advantages and disadvantages. Backgating applies an electric field from beneath the substrate, while electrochemical gating alters the local electronic environment in solution. The uniformity of the electric field in backgating can be challenging, especially in thicker integrated circuits, which typically range from 350 to 500 microns. Thinning the wafer can improve control over surface potential but is a complex and costly process. Understanding these gating techniques is crucial for optimizing the performance of conducting polymers in electronic applications.
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Several ways to gate a conducting polymer on a chip.
Backgating, electrochemical gating.
What is backgating and what advantages/disadvantages would it have?
How does electrochemical gating work?
specifically regarding homogenous charge distribution or uniform electric field applied.
 
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Hyo X said:
Several ways to gate a conducting polymer on a chip.
Backgating, electrochemical gating.
What is backgating and what advantages/disadvantages would it have?
How does electrochemical gating work?
specifically regarding homogenous charge distribution or uniform electric field applied.

By "gating", do you maybe mean "coating" or "plating"? Where have you seen the term "gating"?
 
Gating as in for a transistor.
A three point probe with a source, drain, and a gate to apply a potential across the channel.

In this case, I was saying, using a conducting polymer (or polymer film) as the channel between source and drain.
Backgating would be applying the electric field from under the substrate (i.e. the back)
electrochemical gating involves changing the gate potential on the channel by altering its local electronic environment in solution.

What are the advantages and disadvantages of each?
Can you expect the electric field applied by a backgate to be uniform across the channel?
Would ionic liquid have negative effects on the channel?
thanks
 
Typically integrated circuits are 350 to 500 microns thick so it is difficult to control a surface structure using a backside contact. Typically if the backside of the wafer is contacted at all, it is grounded with a conductive epoxy.

If you want to control the surface potential of the semiconductor in any substantive way, you will have to thin the wafer, which is both challenging and expensive, but is done in practice in some cases.
 
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