Can electroplating Cu on gold improve adhesion?

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The discussion centers on issues related to poor adhesion between electroplated copper and a 200nm gold seed layer. The initial inquiry seeks methods to enhance adhesion and questions whether depositing a layer of copper via e-beam evaporation before plating would be beneficial. A participant expresses surprise at the adhesion problem, prompting further questions about the precursors and pH of the plating solution. Ultimately, the original poster identifies that the quality of copper plating on gold is satisfactory and acknowledges a mistake in their process understanding. They note that while the process of electroplating copper on gold is feasible, the reverse—electroplating gold on copper—is significantly more challenging.
Si14
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Hi all:

I have a 200nm Au seed layer. and I am electroplating Cu on that using a solution. but the result is not good. The adhesion between the electroplated copper and gold seed layer is very poor and it easily peels off.
1-I wonder how can I increase the adhesion between them?

2-Does depositing (e-beam evaporation) a layer of Cu on top of the Au seed layer before plating help?

Thank you very much.
 
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Thank you MLSmateo.
Actually, I found the problem. The Cu-plating quality on Au is good. I made a mistake.
Yes, I have read somewhere that this process is verified, but the reverse process (EP Au on Cu) is very hard to realize.
Thanks again anyways.
 

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