You would use a hot air rework/soldering gun with an appropriate-size nozzle. Have you used a hot air rework station before? BTW, I'm pretty sure you mean a ground pad under the part, not a power pad, correct?yungman said:
Link doesn't work for me...Aaron Crowl said:
berkeman said:
Desoldering and soldering an IC with a power pad under refers to the process of removing and replacing an integrated circuit (IC) that has a power pad located on the underside of the chip. This requires special techniques and equipment to ensure proper connection and functionality.
It is important to desolder and solder an IC with a power pad under because it allows for better heat dissipation and can prevent damage to the IC and surrounding components. It also ensures a secure connection, which is crucial for the proper functioning of the circuit.
The tools needed for desoldering and soldering an IC with a power pad under include a soldering iron, desoldering braid or pump, flux, and tweezers. It may also be helpful to have a magnifying glass or microscope to see the small components more clearly.
The steps for desoldering and soldering an IC with a power pad under are as follows:
Some common mistakes to avoid when desoldering and soldering an IC with a power pad under include using too much heat, not using enough flux, and not properly aligning the IC on the pads. It is also important to be careful not to damage any surrounding components and to clean the area thoroughly before and after the process.