Discussion Overview
The discussion revolves around finding a suitable 68 pin LCC socket that includes a hole for mounting a sample, specifically for use on a coldplate in a dewar. Participants explore various socket options, modifications, and considerations for maintaining thermal contact at low temperatures.
Discussion Character
- Technical explanation
- Debate/contested
- Experimental/applied
Main Points Raised
- One participant inquires about the availability of a 68 pin LCC socket with a central hole for mounting a sample on a coldplate.
- Another suggests cutting a hole in a standard plastic PLCC socket, noting that they have not seen any pre-made options with a cutout.
- A different approach is proposed, involving the use of an open-top socket that can be inverted onto the coldplate, although this may not work for chips requiring thermal contact with a thermal pad.
- Participants share tips for ensuring good contact between the socket pins and the chip, including bending the pins inward and being cautious about hole sizes to avoid contact with pins during cooling.
- One participant describes their experience with ceramic chip carriers and the challenges faced when modifying LCC sockets, including potential loss of contact due to reduced stiffness.
- Concerns are raised about the magnetic properties of socket materials, particularly for sensitive devices, due to ferromagnetic components in most sockets.
- A participant mentions their operating temperature of around 70K and seeks feedback on specific socket options they are considering, including links to various products.
- Another participant shares their experience using a simple gold-plated socket at 77K and notes the challenges of soldering surface mount sockets.
Areas of Agreement / Disagreement
Participants express a range of opinions on the best approach to achieve the desired socket configuration, with no consensus on a single solution. Multiple competing views and methods are presented, reflecting the complexity of the problem.
Contextual Notes
Participants highlight various limitations, such as the potential for loss of contact when modifying sockets, the need for careful consideration of thermal and magnetic properties, and the challenges associated with soldering different types of sockets.