Heat simulation in electrical/mechanical engineering

AI Thread Summary
Simulation software is commonly used to address heat-related issues in electrical and mechanical engineering. The original poster is experiencing thermal cracks on alumina substrates during the firing and cooling processes and is seeking alternative simulation tools due to a lack of access to ANSYS Fluent. OpenFOAM is mentioned as a potential option for simulating these thermal issues. The discussion emphasizes the need for specific software recommendations tailored to the user's challenges. Overall, exploring various simulation tools can help in effectively managing heat-related problems in engineering applications.
Ash.K
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Hi all,

I was wondering if anyone uses simulation software's to tackle the heat related issues in electrical/mechanical engineering?

Regards
 
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Welcome to PF!

This question is very vague, so I would have to just answer yes. If you ask a more specific question, I may be able to provide a more specific answer.
 
russ_watters said:
Welcome to PF!

This question is very vague, so I would have to just answer yes. If you ask a more specific question, I may be able to provide a more specific answer.
Hi Russ,
Thanks for your reply. I am having a lot of thermal cracks on alumina substrates during furnace firing/cooling of conductor/dielectric pastes. So, I wanted to know if there were any software's that could be used to simulate the issue. I have used ANSYS Fluent for simulation of wire annealing but since my company don't have a license for it, I was trying to learn if there are any other software's that can be used. i.e OpenFOAM?
 

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