Troubleshooting MOS Transistor: Importance of Heavily Doped Regions

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Heavily doped regions in MOS transistors are crucial for establishing ohmic contacts, allowing for proper connections to ground and power supply. Without heavy doping, connections to n-well and p-substrate can form rectifying Schottky diode junctions, which block signals in one direction and hinder current flow. This can lead to significant issues in device performance, particularly in bipolar junction transistors (BJTs) and field-effect transistors (FETs). Additionally, the substrate should typically be tied to ground to ensure stable operation, although there are exceptions. Understanding these principles is essential for effective CMOS fabrication and overall semiconductor device functionality.
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hi

Looking at the cross section of MOS transistor, substrate tap(nMOS) and well tap(pMOS) are done on heavily doped regions. Basically, GND is connected to p+ in nMOS, and VDD is connected to n+ in pMOS.. What could be a problem if we don't have heavily doped regios for substrate and well tappings and VDD and GND are directly connected to n- well and p- substrate ?
 
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The reason for heavy doping in the well regions is to establish an *ohmic contact*. All semiconductor devices such as diodes, bjt, IC, etc. use this method. At an interface where a semiconductor must be connected to the outside world through a lead or bond wire (layer to layer interconnect), a rectifying contact won't work. When a semiconductor is bonded to a metal, a Schottky diode junction can be formed if the semicond doping is not heavy enough.

Such a diode junction will block a signal in 1 direction, something we may not want. Visualize a bjt or FET. The lead wire into the collector or drain can form a diode. Likewise for the lead wire in the emitter or source. We now have 2 diodes in opposite directions, meaning that no substantial current can be realized. Heavy doping makes the metal-semicond interface non-rectifying, aka "ohmic".

As far as tying the substrate to ground (actually tied to the source), I've seen cases where the substrate is not tied. A good book on CMOS fabrication will explain in detail the reasons for doing so. I hope I've helped.

Claude
 
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