Airborne structures and circuits in electronics face several critical issues, including susceptibility to environmental factors like temperature fluctuations and humidity, which can affect performance and reliability. Additionally, electromagnetic interference (EMI) poses a significant challenge, potentially disrupting circuit functionality. The complexity of designing lightweight yet durable materials for airborne applications is another concern, impacting both efficiency and cost. Furthermore, ensuring proper thermal management in these structures is essential to prevent overheating and component failure. Addressing these issues is vital for the advancement of reliable airborne electronic systems.