Planar technology in semiconductor sensors involves manipulating the silicon wafer surface through a series of fundamental operations. Key processes include heat treatment methods like diffusion and oxidation, as well as deposition techniques such as chemical vapor deposition (CVD) and epitaxy. Lithography is utilized to define geometries, while chemical attacks, both dry and wet, enable selective material removal. Doping methods, including ion implantation and diffusion, are essential for modifying electrical properties. These procedures collectively form the foundation for preparing integrated circuits.