Decomposition temperature of ZnSe:Cl crystal

AI Thread Summary
The decomposition temperature of ZnSe:Cl semiconductor is a concern for those conducting annealing processes, particularly due to the potential volatilization of chlorine, which poses safety risks. An abstract referenced suggests a decomposition temperature range of 250-300°C. Access to detailed research is limited, as the full paper requires registration with the Japanese Journal of Applied Physics. Users are advised to consider this temperature range when planning their annealing procedures. Ensuring safety during the process is crucial due to the hazardous nature of chlorine.
JeffFang
Messages
1
Reaction score
0
Any one knows what the decomposition temperature of ZnSe semiconductor doped with Cl is? I am doing some annealing with a simple equipment but worring about the volatilization of Cl, which would be dangerous.
Thanks a lot!
 
Engineering news on Phys.org
I stumbled across an abstract of paper with temperatures at 250-300°C.

Try this link - ]Ti/Pt/Au Ohmic Contacts to n-Type ZnSe [/url] - unfortunately, it's only an abstract and registration with the Japanese Journal of Applied Physics is required to downlaod the pdf file.
 
Last edited by a moderator:

Thread 'How could I make it so ferrofluid drops do not coalesce?'

Hello! I've been brainstorming on how to prevent a lot of ferrofluid droplets that are in the same container. This is for an art idea that I have (I absolutely love it when science and art come together) where I want it to look like a murmuration of starlings. Here's a link of what they look like: How could I make this happen? The only way I can think of to achieve the desired effect is to have varying droplet sizes of ferrofluid suspended in a clear viscous liquid. Im hoping for the...
View full post »

Thread 'How do you fabricate microfluidic chips in your lab?'

Hello everyone! I am curious to learn how laboratories handle in-house chip manufacturing using soft lithography for microfluidics research. In the lab where I worked, only the mask for lithography was made by an external company, whereas the mold and chip fabrication were carried out by us. The process of making PDMS chips required around 30 min–1 h of manual work between prepolymer casting, punching/cutting, and plasma bonding. However, the total time required to make them was around 4...
View full post »

Similar threads

Ferromagnetic-Paramagnetic Transition near Room Temperature
Replies
2
Views
2K
Perovskite semiconductors for solar photovoltaic cells
Replies
4
Views
2K
Making perovskite solar cell crystals w/o heating
Replies
2
Views
2K
A Empirical tight-binding sp3s* band structure of semiconductors
Replies
2
Views
2K
Temperature Effects of Young's Modulus for Copper
Replies
5
Views
4K
Regarding Home Lab made to study crystallography
Replies
7
Views
3K
Complete thermal decomposition of specific compounds
Replies
4
Views
3K
Calculation of electrical mean free path in nanomaterials?
Replies
0
Views
3K
I Callan-Symanzik equation for Effective Potential
Replies
1
Views
1K
Can Combustion Synthesis on LiNO3 Produce Lithium Oxide Li2O?
Replies
2
Views
2K

Hot Threads

Recent Insights

Back
Top