Thickness of thin film not affect electrical properties?

AI Thread Summary
In the deposition of zinc oxide thin films on p-type silicon using sol-gel and spin coating, ensuring minimal impact on electrical (Hall Effect) and structural properties is crucial. The thickness of the thin film can significantly influence these properties, with thinner films generally preferred for structural integrity. However, achieving effective lattice matching is challenging with spin coating, as it typically does not allow for close lattice alignment. It is essential to avoid introducing large compressive or tensile stresses during processing, as these can lead to issues like wafer bowing, delamination, cracking, and buckling. Understanding the optimal thickness for the thin film may require experimental validation, as calculations alone may not provide definitive answers.
kimmylsm
Messages
19
Reaction score
0
In deposition of thin film on a p-type silicon, how to make sure the thickness of the thin film will not affect or affect the least the electrical(Hall Effect) and structural properties? how to know how thick is the thin film that most suitable? can it be calculated? by the way, the thin film deposited is zinc oxide using sol-gel and spin coating(where thickness depend on speed are set)?
 
Engineering news on Phys.org
You'd want to try to lattice match as close as possible and make sure the fermi levels line up approximately well. Structurally, the thinner the film the better. Electrically, I'm not sure since if it doesn't affect the silicon it won't be behaving like zinc oxide.
 
pseudophonist said:
You'd want to try to lattice match as close as possible

Lattice matching isn't possible here, even approximately. Lattice matching may occur when a crystalline film or structure is grown slowly on a substrate with (approximately) the same lattice constant. It will never occur with spin coating.

You do want to avoid large compressive or tensile stresses that can be created by further processing steps (perhaps this is what pseudophonist meant). Large film stresses can cause wafer bow, delamination, cracking, buckling, and so on.
 
Hello! I've been brainstorming on how to prevent a lot of ferrofluid droplets that are in the same container. This is for an art idea that I have (I absolutely love it when science and art come together) where I want it to look like a murmuration of starlings. Here's a link of what they look like: How could I make this happen? The only way I can think of to achieve the desired effect is to have varying droplet sizes of ferrofluid suspended in a clear viscous liquid. Im hoping for the...
Hello everyone! I am curious to learn how laboratories handle in-house chip manufacturing using soft lithography for microfluidics research. In the lab where I worked, only the mask for lithography was made by an external company, whereas the mold and chip fabrication were carried out by us. The process of making PDMS chips required around 30 min–1 h of manual work between prepolymer casting, punching/cutting, and plasma bonding. However, the total time required to make them was around 4...
Back
Top