Can Previous Results Estimate Box Response When Plate Cools Faster?

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The discussion revolves around estimating the cooling response of a box mounted on a plate in a vacuum as the plate's cooling rate changes from 3 C/min to 4 C/min. The user seeks to determine if previous results can predict the box's response under the new cooling conditions. Participants point out that the problem lacks clarity regarding dimensions, assumptions, and the direction of heat transfer between the plate and the box. The influence of radiation in a vacuum is also highlighted, suggesting that the scenario is more complex than pure conduction. Overall, the need for clearer definitions and parameters is emphasized to accurately assess the box's cooling response.
drewbagel423
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Let's say I have a box, mounted to a plate in a vacuum (pure conduction). The system is initially at a steady state at temperature Ti. The plate then begins cooling at a rate of 3 C/min. The box is going to cool at some rate, and with some time constant. For this test, I have place a thermocouple on the box, so I can measure its response.

Now I want to run it again such that the plate cools at a rate of 4 C/min. Is it possible to use the previous results to estimate the box's response for this new profile? If so, how could I go about doing it?

TIA
 
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vacuum does not necessarily mean conduction since there is also radiation. Your problem is rather ill defined. What are the dimensions, assumptions, why does the plate begins cooling?
I cannot make up from you description if heat is going from the plate to the box or vise-versa
 
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