NoTime said:
Fair enough.
Part of what I said to you made me realize what I had forgotten.
So I give you credit for fixing my mistake.
Your number of 44 also solves for a 20ma RMS current, except you got the count right.
One of the good things about PF is that if you do get things wrong there are people to set you on the right path,
Thanks.
You're a better man than me, NoTime.
I've been too under the weather to respond lately. I may still be too dopey.
We don't really see this exexcise as the same problem. In my view, the objective is to obtain the most luminosity with the least component count and cost, without thermally degrading the components. Thermal degregation is everything. This means keeping the peak current within bounds while delivering the highest possible average current. These things are diodes, and these sort of curcits the dynamic impedence is not a useful number given the wide swing in bias voltage. The current through one of these LEDS varies roughly as the exponent of the bias voltage, I'm sure you know. Roughly,
I = exp(kE)-1
P = c(E exp(kE) - 1)
So as the voltage increases from zero the current creeps slowly up with a ugly shape peak in as the AC peaks. The idea in any design is to keep the peak instantanious power down. But it's a little more than that. Thermal degragation is usually about wire bond integrity and more importantly mirgration of dopants at the junction. In this case you might add degregation of the fluorescent dyes. Beats me. The curves you see in the data sheet only hint at the thermal limits. You might ask yourself why these boundries in their Allowable Forward Current area plots are drawn where they are. There are six different boundries going on; I don't know where they all come from.
You know about thermal circuits right? In any case this is all for general consuption anyway. The heat driven into the die is the instantanious resistive power lost integrated over time. The heat conducted out depends on the bulk thermal resistance as the heat is conducted away via leads and plastic case. So in the simple situation of single pulse power, for instance, the instantanious temperature of the die ramps up like voltage across a capacitor in parallel with a resistor, being charged with a current source. To make a long story short, after approximating the repetative current duty cycle if you know the normalized thermal frequency response curve you obtain the heating obtained as if it were heated by a constant DC bias.
As there is no frequency response curve provided by the manufacturer, we can only guess based upon where the boundries show up in the Allowable Forward Current plots. The thermal response curves are based upon duty cycle
and frequency. As Nichea Corp was not gracious enough to let us know the test frequency used in obtaining their Duty Ratio vs. Allowable Forward Current plot, we can just guess or defer to experimentation. [Edit: If it's 10KHz or better which is pretty typical for strobed character/segment multiplexing, then it's useless. If it's 1000 Hz, which should be more typical for scrolling displays that use descete diode assemblies it could be somewhat usefull.] The latter (experimentation) is what I recommend. The 44 diode count solution I had is pretty dismal: assuredly within max allowable current spec, but probably about as bright as running on 10mA DC bias.